Cobalt (Co) Sputtering Targets, Purity: 99.95%, Size: 8'', Thickness: 0.125''
- Calculated at Checkout
1 piece/660 €
Please contact us for quotes on larger quantities !!!
Cobalt (Co) Sputtering Targets
Purity: 99.95%, Size: 8'', Thickness: 0.125''
Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes.
The process with sputter targets is repeatable and can be scaled up from small research and development projects. The proses with sputter
targets can be adapted to the production batches involving medium to large substrate areas. The chemical reaction can occur on the target
surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process
but allow experts a large degree of control over the growth and microstructure of the area.
Applications of Sputtering Targets;
- Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering
that involves eroding material from a "target" source onto a "substrate" such as a silicon wafer.
- Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy
is needed and selectivity is not a concern.
- Sputter targets is also used for analysis by etching away the target material.
One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered,
the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the
target material can be determined and even extremely low concentrations of impurities are detected.
Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and
chemical properties of airless bodies, such as asteroids and the Moon.
Cobalt is a chemical element with symbol Co and atomic number 27. Cobalt is a hard, lustrous, silver-gray metal. Cobalt is used in the preparation of
wear-resistant, high-strength alloys and cobalt is widely used in magnetic recording because it is only one of the three room temperature ferromagnets
that has unaxial symmetry and therefore can be used in digital recording.
Cobalt makes alloys easily with the other metals and temperature stability of these alloys make them suitable for use in turbine blades for gas turbines
and jet aircraft engines. Cobalt based alloys are also corrosion and wear-resistant. Cobalt alloys are also used for dental prosthetics where they are
useful to avoid allergies to nickel. When we look at the usage areas of cobalt sputtering targets, it can be said that cobalt sputtering targets can be used
in sputtering applications to produce thin films on microelectronic devices such as microprocessors, DRAM's, etc. DC magnetron sputtering efficiency
relies heavily on the ability of a magnetic field to trap electrons liberated from the target and direct them back to the negatively charged target where
they are repelled. When we look at the usage areas of cobalt sputtering targets, it can be said that cobalt sputtering targets can be used in sputtering
applications to produce thin films on microelectronic devices such as microprocessors, DRAM's, etc.