Titanium Nitride Sputtering Targets

Titanium Nitride Sputtering Targets

An extremely hard ceramic material, Titanium Nitride (TiN) is often used as carbide, steel, titanium alloys, and aluminum components to enhance the surface properties of the substrate. The molecular weight of Titanium Nitride is 61.87 g/mol and its appearance is a brown target. The density of the Titanium Nitride sputtering target is 5.24 g/cm3. Titanium Nitride sputtering target has an exact mass of 61.951 while its monoisotopic mass is 61.951. We create Titanium Nitride sputtering targets with the smallest possible grain size and highest possible density. We provide these sputtering targets with a thickness of 3.0 mm and 6.0 mm, hot pressed and purity of 99.5%. Titanium films are popularly used as wear coatings, decorative gold coatings, and passivation layers for VLSI. A sputtering process target that is reactive can deposit titanium nitride films with exceptional optical, mechanical and electrical properties. Our packaging process makes sure that the delivery of a product is made without any sort of defect.

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