Tin Sputtering Targets
Tin is a relatively common element and it has an abundance of 2.2 ppm in the crust of the earth. Tin has good chemical resistance that is why it is commonly used as a preventive coating for other metals to resist corrosion. The molecular weight of the Tin sputtering target is 118.69 and it has a density of 7.265-7.31 g/cm3 (20 °C). The melting point of the Tin sputtering target is 232 °C and its boiling point is 2602 °C. Tin sputtering targets have applications in electronics, nuclear energy, and laboratory research. Tin sputtering targets are produced by us in high purity with the smallest possible average grain size for utilization in physical vapor deposition display, chemical vapor deposition display, semiconductors, and optical applications. Tin sputtering allows for thin deposition of a very high purity sputtering oxide or metallic material onto another solid substrate due to ionic bombardment. To keep the purity of Tin sputtering targets, we follow all the applicable standards.