Carbon Aluminum Nitride (AlNC) Micron Powder
Carbon aluminum nitride is a chemical compound with the symbol AlCN. Its melting point is nearly 2200℃ and has a density of 3.26 g/cm3. AlCN dissolves slowly in mineral acids through grain boundary attack, and in strong alkalis through attack on the aluminum nitride grains. The material hydrolyzes slowly in water. Aluminum carbon nitride is resistant to attack from most molten salts, including chlorides and cryolite. Carbon Aluminum Nitride is synthesized by the carbothermal reduction of aluminum oxide in the presence of gaseous nitrogen or ammonia or by direct nitridation of aluminum. Carbon aluminum nitride micron powder has applications in electronic devices, optical devices, and in composites. It is used in manufacturing of integrated circuit boards. It has high thermal conductivity, high hardness and high electrical conductivity. It used in the fabrication of metal matrix and polymer matrix composites that is used in heat seal adhesives and electronic packaging materials. It is also used in making high thermally conductive ceramics, high temperature crucibles, heat sinks, and thermally conductive filler for polymers.