Aluminum Sputtering Targets
Aluminum sputtering targets are very pure and thus guarantee high conductivity of the material. Homogeneous microstructure and superior surface quality of targets ensure less particle formation during spraying and uniform erosion. Aluminum targets for sputtering and coating of custom size metal are made by hot isostatic printing technology, the grain size is smaller than 100 µm, we make sure that the sputtering targets or cathodes have a uniform and compact internal structure, with tiny titanium particles evenly distributed in the aluminum base. Aluminum Sputtering Target with customer-specific size has a particularly homogeneous microstructure and excellent surface quality, mainly used for the metallization in thin-film transistors for TFT/LCD monitors, TV sets, mobile phone displays, and CDs. Our materials are either applied using the reactive magnetron sputtering process or through arc evaporation and form a nitride hard material layer on the substrate in a nitrogen atmosphere. We make sure that we provide every product to meet your requirements. The purity of the aluminum sputtering target we supply is 99.9% to 99.9999%.