Boron Nitride (BN) Micron Powder

Boron nitride is a thermally and chemically resistant refractory compound of boron and nitrogen with the chemical formula BN. It exists in various crystalline forms that are isoelectronic to a similarly structured carbon lattice. Its melting point is nearly 2600℃ and has a density of 2.27 g/cm3. Key properties of boron nitride powders can be sorted as their high thermal conductivity, low thermal expansion, good thermal shock resistance, high electrical resistance, low dielectric constant and loss tangent, microwave transparency, non-toxicity, easily machinability- non-abrasive and lubricious, chemical inertness, non-wetting by most molten metals. Typical uses of boron nitride micron powders are electronic parts (heat sinks, substrates, coil forms, prototypes), boron doping wafers in silicon semiconductor processing, vacuum melting crucibles, CVD crucibles, microcircuit packaging, sputtering targets, high precision sealing, brazing and metallizing fixtures, microwave tubes, horizontal caster break rings, low friction seals, plasma arc insulators, high temperature furnace fixtures and supports.