Aluminum Silicon Copper (AlSiCu) Sputtering Targets, Purity: 99.999%, Size: 4'', Thickness: 0.250''

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Aluminum Silicon Copper (AlSiCu) Sputtering Targets

Purity: 99.999%, Size: 4'', Thickness: 0.250''   

Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes.
The process with sputter targets is repeatable and can be scaled up from small research and development projects. The proses with sputter
targets can be adapted to the production batches involving medium to large substrate areas. The chemical reaction can occur on the target
surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process 
but allow experts a large degree of control over the growth and microstructure of the area. 

Applications of Sputtering Targets;

  • Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering
          that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
  • Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy
          is needed and selectivity is not a concern.
  • Sputter targets is also used for analysis by etching away the target material.

One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, 
the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the
target material can be determined and even extremely low concentrations of impurities are detected.

Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and 
chemical properties of airless bodies, such as asteroids and the Moon.

Aluminum is both light weight and high strength. Aluminum plating is ideal for use on motorcycles, automobiles, and aircrafts. Aluminum is usually
alloyed with a range of elements to enhance performance and structural properties including copper and silicon.

Aluminum silicon copper alloys are well known for very high strength when compared with aluminum silicon alloys. Because of having high strength,
aluminum silicon copper sputtering targets are suitable for using in aerospace and transportation sector.

Aluminum silicon copper sputtering targets has excellent casting and machining characteristics. Corrosion resistance and weldability of this alloy are
very good and these properties make it suitable for using in engine parts, gas and oil pans, and general commercial applications.

Aluminum silicon copper sputtering targets can also be used for semiconductor applications. Since this alloy is in high purity, it forms a uniform film.

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