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Aluminum Oxide (Al2O3) Sputtering Targets

Purity: 99.999%, Size: 4'', Thickness: 0.125''  

Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and sizes.
The process with sputter targets is repeatable and can be scaled up from small research and development projects. The proses with sputter
targets can be adapted to the production batches involving medium to large substrate areas. The chemical reaction can occur on the target
surface, in-flight or on the substrate depending on the process parameters. The many parameters make sputter deposition a complex process 
but allow experts a large degree of control over the growth and microstructure of the area. 

 Applications of Sputtering Targets; 

• Sputtering targets is used for film deposition. The deposition made by sputter targets is a method of depositing thin films by sputtering
        that involves eroding material from a "target" source onto a "substrate" such as  a silicon wafer.
• Semiconductor sputtering targets is used to etch the target. Sputter etching is chosen in cases where a high degree of etching anisotropy
        is needed and selectivity is not a concern.
• Sputter targets is also used for analysis by etching away the target material.

One of the example occurs in secondary ion spectroscopy (SIMS), where the target sample is sputtered at a constant rate. As the target is sputtered, 
the concentration and identity of sputtered atoms are measured using mass spectrometry. By helping of the sputtering target, the composition of the
target material can be determined and even extremely low concentrations of impurities are detected.

Sputtering target has also application area in space. Sputtering is one of the forms of space weathering, a process that changes the physical and 
chemical properties of airless bodies, such as asteroids and the Moon.

Aluminum oxide is a chemical compound of aluminium and oxygen with the chemical formula Al₂O₃. Al₂O₃ is significant in its use to produce 
aluminium metal, as an abrasive owing to its hardness, and as a refractory material owing to its high melting point. Aluminum oxide thin films which can 
be obtained by aluminum oxide sputtering targets are widely used in many mechanical, optical and microelectronic applications because of their excellent 
properties, mechanical strength and hardness, transparency, high abrasion and corrosion resistance, as well as insulating and optical properties. All these 
properties of aluminum oxide film depend on different parameters of sputtering system such as sputtering rate, distance between the target and substrate, 
pressures of reactive gases etc.

Aluminum oxide thin films which find various important applications in technology like in optoelectronics, tribology, sensorics, nanolithography 
have been deposited by various techniques as magnetron sputtering, atomic layer deposition, electron beam evaporation, spray pyrolysis, oxidation
of aluminum film. 

As a summary Al₂O₃ has unique properties in terms of chemical inertness, mechanical strength and hardness, high abrasion and corrosion resistance, 
as well as its high electrical breakdown field and high dielectric constant and thin films obtained by aluminum oxide sputtering targets have received 
growing attention of researchers worldwide. To use aluminum oxide sputtering targets in your researches which is related to various mechanical and
microelectrical applications such as protective coatings, diffusion barriers, electronic seals, dielectric layers, optical layer, etc